Senior Packaging Design Engineer


[ Taiwan Online Job Listing ] [ FAQ ]

Posted by on March 21, 19102 at 21:54:31:

Great opportunity with a well financed privately held fabless integrated circuit company located in Southern California.

Desired:

· 5 or more years of hands on experience in designing and building high frequency RF metal and/or ceramic packages or modules for microwave or fiber optic systems.

· Background in microwave, wireless, SONET/OC-192/OC-768, fiber optic ICs, or optical networking is preferred.

· Familiar with standard commercial off-the-shelf packages from major vendors.

· Familiar with CAD tools such as ADS, HFSS, IE3D

· Familiar with microwave and/or fiber optic measurement equipment.

· Test and troubleshoot complete packaged chips or modules.

· M.S. in Electrical Engineering or equivalence.

This individual will be expected to design, test, and troubleshoot RF metal and/or ceramic packages for next generation 10G and 40G fiber optic components. The ideal candidate will have at least 3 years of experience in designing broadband amplifiers and/or high-speed transceivers using custom RF metal and/or ceramic packages.







[ Taiwan Online Job Listing ] [ FAQ ]