Posted by on November 26, 1999 at 07:38:43:
Dallas, USA
Texas Instruments has always led the field in the development of the electronics that have transformed everyone's lives and are the world leader in Digital Signal Processing Solutions. DSPS, used heavily in wireless communication and hard-disk drives is a major technology fuelling growth in new applications such as internet appliances, TV set-top boxes and cameras.
To continue to innovate, Texas Instruments need engineers that are the best in their field and they offer an opportunity to play an active role in designing the future of electronics and in turn shape the way that people live in the future.
Responsibilities:
The Photolithography Program Section supports efforts of Logic business entities to prototype &evaluate new devices & designs.
Devices must have greater than 30% multi-probe yield and LPY prior to transfer to production wafer fabs
Timely introductions of advanced technologies will help TI to increase market penetration, market share, & profit margins.
Photolithography Process Engineer for supporting advanced sub 0.25u lithography processes for Logic, & Embedded Flash technologies from development, prototype ramp, & manufacturing fanout.
Provide support for process & tool improvement for manufacturability of photolithography processes.
Skills required:
Must be capable of solving problems by learning, looking, testing & evaluating new photolithography processes & tool capability to meet margins against product yield roadmaps
Must be able to release new tools & processes to manufacturing in time to meet internal & external requirements of technology nodes
Hands on experience with semiconductor processes, tools & materials
Must have skills pertaining to stepper/scanner optics technology & resist chemistry to utilize for new process development.
Must have demonstrated skills to be technical problem solver
Must be able to increase our fundamental understanding & increase our manufacturability margins on photolithography processes by characterizing devices/flows which support <0.25u technology nodes
Able to create experience with existing TI Experimental Designs & Analysis tools
Focused & detailed understanding to Photo processing coupled with ability to integrate & interact with other process & product engineers to increase margins for manufacturing in total product or process flow
Experience in <0.25U Photolithography processes with ability to translate this exp into TI's leading edge DSP, Embedded Flash, Microprocessor, & BiCMOS programs
Prefer U.S. equivalent Bachelors Level Degree in Optics, Chemistry or Physics
Experience with TI SMS production management systems, as well as. Microsoft Word, Excel, PowerPoint, & Outlook communication & data analysis packages
Work in Wafer Fab 6-8 hrs per day
Class 1 cleanroom.