Field Application Hardware Engineer


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Posted by on November 23, 1998 at 21:47:42:

POSITIONS AVAILABLE IN JAPAN AND TAIWAN

Job Description:

Duties/Responsibilities:
This position focuses on working directly with
3Com's MCD OEM Customer engineering organizations
who are integrating 3Com's award winning Fax/Modem
and Fast Ethernet NIC Mini-PCI solutions into their
embedded designs. You will tightly integrate
yourself into our internal design teams to
learn about all NIC, silicon and board, Fax/Modem,
as well as combo projects and act as a consultant
to these OEM's by providing design and schematic
review expertise for their product introductions.
Responsibilities also include technical collateral
generation, cross training for other Field
Applications Engineers, as well as acting as the
sole engineering interface to 3Com Design Engineers.

Qualifications:
Ideal candidates will not only understand LAN and
WAN networking at a high level, but should also
possess a minimum of six years experience in
analog/digital applications, PCB layout.
Experience creating data sheet/apps notes with HW
simulations a plus. Excellent written and oral
communication skills in both Japanese and English.
This position requires constant communication with
MCD Design Engineering as well as OEM Marketing
Engineers as well as external customers. Ability
to make sound decisions on proprietary information
is a must.


Skills/Experience:
6+ years experience in product definition,
parts selection, circuit design, Spice simulation
and schematics entry. Must be familiar with tools
such as digitizing oscilloscope, logic analyzer,
DVM and lab procedures.

Education:
BSEE/MSEE







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