Posted by on November 06, 19100 at 21:17:18:
We are a well established equipment contract manufacturer for the semiconductor IC assembly and packaging industries. We are expanding rapidly and invites candidates with the qualities and experiences to join the design and development team to meet our challenging opportunities.
1) Design and Development Manager (Wire-Bonders Equipment)
The Job:
As Head of the design team, you are responsible for motivating, guiding and managing the team members to achieve goals and maximizing each team member’s potential. You are expected to formulate the design and development of the wire-bonders mechanism, specifications, quality, schedule and resources for the overall design and development project/plan.
Requirements :
a.Msc/Degree in Electronic/Electrical/Mechanical Engineering
b.Minimum 3 years hands-on process on gold wire-bonders, as an engineer and 5 years experience as a design manager
c.Excellent managerial skills with strong analytical, organizational leadership, communication and interpersonal skills
d.Broad knowledge of IC assembly and packaging systems
e.Broad knowledge of project management methodologies is a plus