Posted by on November 23, 1999 at 03:21:41:
Job Description
Resident Process/Packaging Engineer in a leading subcontracting Assembly house in Laguna. This person will be responsible for managing the entire business of assembly manufacturing at this site. The person will be required to transfer packages (BGAs/Flip Chips) from a development stage into manufacturing and make the process & yields stable.
Job Requirements
3-5 years experience in Assembly process Engineering / Package Design of high density QFPs/BGAs/Flip Chips.
We are a US Based company and will offer stock options and competitive salary.